MeiVac Precision MCT-8000 Cluster Tool

Ferrotec’s MeiVac MCT-8000 Cluster Tool was developed as a high reliability, high uptime, expandable system platform which has been optimized for hard disk drive thin film head applications.

Front panel for Clean Room Environments
The MCT-8000 system front panel is installed in production clean-room environments, isolating tool components from clean room process areas.

Highlights

  • Production-proven 24/7 cluster tool
  • Fully automated processing of up to 200mm ∅ substrates
  • Available with 2 to 4 process modules and with 2 load-locks
    • Process modules are field retrofittable
  • Brooks MX-600 cluster platform with Mag 7 robot
  • Every chamber has a dedicated slot valve and pump stack with turbo & water pump
  • Cassette present sensor, wafer present sensors, and wafer slideout sensors
  • Aligner with notch detection and orientation
  • Wafer temperature sensor
  • Integrated RGA for system control
  • Optimized for Hard Disk Drive Thin Film Head application
  • Al2O3, SiO2, Ta2O5
    • From 0.2μ to 23μ for Al2O3
    • O2 process capable for enhanced side wall coverage
  • <1.0% sigma/mean uniformity and layer concentricity
  • High rate deposition processes (>950A/min)
  • Proprietary, multi-MFC gas distribution system for process modules
  • Helium backside gas cooling
  • RF substrate bias option to enhance deposited film properties
  • Available for metal or reactive dielectric material deposition
  • Windows 7 based UI and GE RX3i Programmable Logic Controller (PLC)
  • Profibus communications to key components on the system
  • Configurable SECS/GEM option for communication with most fabs’ Manufacturing Execution Systems (MES)

Expandable System Offers Scalable Flexibility for Production Environments

With Ferrotec’s MeiVac MCT-8000 cluster tool, you can configure the system to match your production requirements. The MCT-8000 supports up to four process modules with two load-locks. The process modules are field-retrofittable, enabling you to expand your system capacity easily.

Process Modules are Field-retrofittable
A Flexible System designed to scale with your production volumes.

Automation at the Heart of the System

The MCT-8000 is built around a production-focused automation system. The system uses a Brooks MX-600 cluster platform with a Mag 7 robot. Every chamber has a dedicated slot valve and pump stack with a turbo pump and a water pump. The system incorporates a complete array of sensors and an integrated RGA for system control. The MCT-8000 also features a configurable SECS/GEM option for communication with fabs’ Manufacturing Execution Systems (MES).

Highlights

  • Production-proven 24/7 cluster tool
  • Fully automated processing of up to 200mm ∅ substrates
  • Available with 2 to 4 process modules and with 2 load-locks
    • Process modules are field retrofittable
  • Brooks MX-600 cluster platform with Mag 7 robot
  • Every chamber has a dedicated slot valve and pump stack with turbo & water pump
  • Cassette present sensor, wafer present sensors, and wafer slideout sensors
  • Aligner with notch detection and orientation
  • Wafer temperature sensor
  • Integrated RGA for system control
  • Optimized for Hard Disk Drive Thin Film Head application
  • Al2O3, SiO2, Ta2O5
    • From 0.2μ to 23μ for Al2O3
    • O2 process capable for enhanced side wall coverage
  • <1.0% sigma/mean uniformity and layer concentricity
  • High rate deposition processes (>950A/min)
  • Proprietary, multi-MFC gas distribution system for process modules
  • Helium backside gas cooling
  • RF substrate bias option to enhance deposited film properties
  • Available for metal or reactive dielectric material deposition
  • Windows 7 based UI and GE RX3i Programmable Logic Controller (PLC)
  • Profibus communications to key components on the system
  • Configurable SECS/GEM option for communication with most fabs’ Manufacturing Execution Systems (MES)

BROCHURE

Contact MeiVac for pricing and availability

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